罗彻斯特电子公司（Rochester Electronics）作为全球最大的停产和成熟半导体产品的授权生产商和分销商，宣布会继续提供LSI公司的HCMOS（高速互补型金属氧化物半导体） ASIC门阵列产品的生产服务。有了LSI公司的授权，罗彻斯特可以重建并生产完整的硅栅HCMOS工艺逻辑阵列产品，包括从3到0.35微米间9种工艺节点的1000多种产品设计。
罗彻斯特重建此产品线可以避免客户重新进行代价昂贵的系统设计，目前已经完成验证了LSI如下产品线：2-micron LL7000 channeled gate array series (CMOS7K Series), 1.0-micron LCA100K channel-free gate array series, 0.6-micron LCA300K channel-free gate array series, 0.50-micron LCA500K channel-free gate array series, and 0.35-micron G10 cell-based series.
LSI将会提供给罗彻斯特公司门阵列产品IP和数百种存档的设计数据库，通过罗彻斯特的半导体复型流程（SRP）就可以继续提供某些授权产品。罗彻斯特公司先进的SRP综合了存档认证，样品拆解，工艺匹配，源目标对比，SPICE分析以及对原厂家规范的验证等等。这一流程将保证罗彻斯特生产的器件完全与LSI原门阵列产品保持外形，尺寸和功能的一致。
Rochester公司号称生产2万多种从民用到航天航空级的各种封装形式的半导体元器件产品。此番重建的虽然是老旧工艺，但是可见依然在军工，航天和工业领域有长久应用，利润可期。LSI从80年代起家就在搞的技术又开出了新花。
附LSI与Agere合并前的milestone，现在网站上只有简化版。
2006
•LSI announces ZEVIO™ processor architecture for consumer market. ZEVIO speeds time-to-market and enables low-cost, low-power 3D graphics and sound features for consumer electronics products.
•LSI and YesVideo introduce integrated DVD recorder software for indexing video content.
•LSI will focus on business growth opportunities in information storage and consumer markets.
•LSI first to demo Serial Attached SCSI (SAS) switch.
2005
•United States Patent and Trademark Office awards LSI its 3,000th patent.
•LSI announces new leadership team; will focus on primary markets (custom integrated circuits, consumer products, and storage platforms and products); Abhi Talwalkar named LSI president and CEO.
2004
•LSI introduces industry’s first single-chip 3 Gb/s Serial Attached SCSI (SAS) controller IC.
•Seagate Technology demonstrates the LSI RapidChip Platform ASIC technology in its Savvio (Savvy I/O) family of 2.5-inch enterprise-class disc drives.
2003
•LSI introduces industry’s first single-chip hard disk drive (HDD) and DVD recorder processor, the DoMiNo® 8650, for use in dual-drive digital recorders.
•LSI achieves 80 percent market penetration with its Ultra320 SCSI server controller, garnering key design wins with major OEMs.
•LSI partners with Beijing E-world to develop technologies for new high-definition format in China called EVD (enhanced versatile disc).
2002
•LSI introduces the G90™ 90-nanometer ASIC process technology, built upon a process platform jointly defined by LSI and TSMC.
•LSI becomes the first company to make a full line of Ultra320 SCSI host bus adapters (HBAs) available commercially.
•LSI introduces innovative semiconductor platform, RapidChip®.
2001
•LSI acquires consumer market leader C-Cube Microsystems Inc. in an accretive stock-for-stock transaction valued at $851 million.
2000
•LSI introduces industry’s first dual-channel PCI to Fibre Channel integrated controller featuring 2 Giga Baud data rates per channel.
•LSI announces Gflx™ 0.13-micron ASIC process technology, which offers 78 million usable logic gates.
1999
•Sony Computer Entertainment selects LSI to supply key I/O processor for its next generation PlayStation video game system, featuring 100 percent backward compatibility to the first PlayStation.
1998
•LSI introduces its G12™ ASIC 0.18-micron process technology, offering up to 26 million usable logic gates on a single chip.
1997
•LSI unveils G11™ 0.25-micron ASIC process technology, offering more than 8 million usable gates.
•The BBC selects LSI to develop a single-chip digital terrestrial television solution.
•LSI wins an Emmy Award for developing a real-time estimation encoder for General Instruments Corporation (now Next Level Systems).
1996
•LSI announces industry’s first Fibre Channel core, with automated control functions for disk drives, RAID arrays, Internet servers, video-on-demand, imaging and transaction processing.
•LSI announces industry’s first 1.25-billion bit-per-second CMOS serial transceiver, the GigaBlaze™ G10 SeriaLink® Core.
1995
•LSI introduces a new generation of ASIC process technology, the G10™ series, offering up to 5 million usable gates.
1994
•Sony Computer Entertainment introduces the PlayStation® video game system, featuring the LSI system-on-a-chip capability and using the company’s CoreWare design program.
1993
•LSI introduces 0.5-micron ASIC technology, capable of integrating up to nine million transistors on a single chip.
•CoreWare methodology is utilized to develop the LSI ATMizer™, the industry’s first single-chip reprogrammable solution for asynchronous transfer mode networking.
1992
•LSI introduces CoreWare® design program, a new approach to developing systems and building complete electronic systems on a single chip.
•LSI delivers the industry’s first RISC microcontroller with floating-point capability on-chip; target is cost-sensitive embedded applications where power and space are critical.
1991
•LSI develops JPEG (still picture), MPEG (full-motion video), and video-teleconferencing products for digital video markets.
•LSI participates in two HDTV (high definition television) projects in Japan. (Only U.S. company selected.)
•LSI introduces the industry’s first single-chip embedded graphics controller, targeting high-performance graphics applications.
1989
•LSI listed on the New York Stock Exchange under the symbol LSI.
•World’s first all-ASIC workstation is produced based on LSI technology.
1988
•LSI becomes the only semiconductor company to offer 32-bit RISC microprocessors for both MIPS and SPARC (Scalable Processor ARChitecture).
•LSI LCB007 becomes the industry’s first cell-based custom ASIC capable of integrating 200,000 gates on a single chip.
1986
•LCB15 Series cell-based ASIC family offers high density and performance and rivals full custom design methodologies. Based on 1.5-micron HCMOS process technology.
•LSI introduces its first standard product line, including 32-bit and 16-bit multipliers, 16-bit multiplier accumulators and 32-bit floating-point processors.
1985
•LSI announces LCA10000 Compacted Array Family, with 50,000 available gates.
1984
•LL8000 Series 2-micron gate array product family introduced.
1983
•LSI becomes public company with initial offering of $152 million; common stock is traded on NASDAQ as LLSI.
•LSI introduces concept of regional ASIC engineering design centers, bringing service closer to customers
1982
•LL3000 Series CMOS Gate Array (3.5 micron, 2,500 gates) announced.
•LL5000 Series (3-micron, 2-layer metal) introduced.
1981
•LSI Logic Corporation founded; designs semiconductors customized to the specific application requirements of customers. ASIC (application specific integrated circuit) market emerges.
•LC3100 Series of CMOS arrays (1,782 gates) announced.
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